Thermally Conductive Adhesives Bond-Ply 100

Thermally Conductive Adhesives Bond-Ply 100 | BERGQUIST

Taśma termoprzewodząca Bond-Ply 100

Features
• High bond strength to a variety of surfaces
• Double-sided, pressure-sensitive adhesive tape
• High performance, thermally conductive acrylic adhesive
• Can be used instead of heat-cure adhesive, screw mounting or clip mounting

Applications
• Mount heat sink onto BGA graphic processor or drive processor
• Mount heat spreader onto power converter PCB or onto motor control PCB

Specifications
Thickness: 0.005/0.008/0.011" (0.127/0.203/0.279mm)
Reinforcement Carrier: Fiberglass
Dielectric Breakdown Voltage (Vac):3000/6000/8500
Thermal Conductivity: 0.8W/m-K

Please calculate 5 plus 9.
 

Go back

Recommended products

tyrystor arrow

T32-25-06
LAMINA

Moduł diodowy arrow

DD160N22K
Infineon

Czujnik ciśnienia arrow

HSCMRRD100PDSA3
Honeywell

Czujnik ciśnienia arrow

SSCSNBN005PDAA5
Honeywell

Our suppliers

There are no items in your cart.