Thermally Conductive Filling Materials Gap Filler 3500S35

Thermally Conductive Filling Materials Gap Filler 3500S35 | BERGQUIST

Materiał termoprzewodzacy Gap Filler 3500S35

Features
• Two-part formulation for easy storage
• Thixotropic nature makes it easy to dispense
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient or accelerated cure schedules

Applications
• Automotive electronics
• Discrete components to housing
• PCBA to housing
• Fiber optic telecommunications equipment

Specifications
Density (g/cc): 2.9
Hardness (Shore 00): 32
Dielectric Strength (V/mil): 275
Thermal Conductivity: 3.6W/m-K

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