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          Снимките са само с информационна цел. Вижте спецификацията на продукта
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Features
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction
• Electrically isolating
Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• RDRAM memory modules / chip scale packages
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader
Specifications
Thickness: 0.010-0.020" (0.254-0.508mm)
Hardness, Bulk Rubber (Shore 00): 40
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.5W/m-K
Интересувате ли се от този продукт? Имате ли нужда от допълнителна информация или индивидуални цени?
Трябва да сте влезли
Features
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction
• Electrically isolating
Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• RDRAM memory modules / chip scale packages
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader
Specifications
Thickness: 0.010-0.020" (0.254-0.508mm)
Hardness, Bulk Rubber (Shore 00): 40
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.5W/m-K
 Какво представляват термопроводимите материали?
                                                               
                                                                             
                                                Какво представляват термопроводимите материали?
                        
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