Tepelné podložky Q-podložka 3

Features
• Thermal impedance: 0.35°C-in2/W (@50 psi)
• Eliminates grease processing constraints
• Electrically isolating and easy to handle
• Conforms to surface textures
• Installation prior to soldering and cleaning

Applications
• Between a transistor and a heat sink
• Between two large surfaces such as an L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors or transformers
• U.L. File Number E59150

Specifications
Thickness: 0.005" (0.127mm)
Dielectric Breakdown Voltage (Vac): N/A
Thermal Conductivity: 2.0 W/m-K
Construction: Silicone/Fiberglass