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Silver-filled electrically conductive epoxy adhesive is an effective and convenient alternative to traditional joining methods when it comes to bonding metal to metal. This adhesive is highly conductive and provides strong, durable connections you can rely on. With its smooth, thixotropic nature, it is perfect for assembling and prototyping metal enclosures, making the assembly process simple without costly machining, welding, or fasteners. This adhesive also acts as an excellent solution for cold-soldering repairs and can be used as a solder substitute for heat-sensitive electronic components and conductive joints. It also offers excellent EMI/RFI shielding and can effectively fill gaps between metal plates.
Product Code | CA-SE |
---|---|
Color | Silver |
Curing Time at 23°C | 24 hours |
Recommended Curing Time | 48 hours |
Density | 3.0 g/cm³ |
Lap Shear Strength (aluminum to aluminum) | 600 N/cm² |
Temperature Range | -50°C to 200°C |
Bond Resistance (aluminum to aluminum) | < 10mΩ/cm² |
Thermal Conductivity | 4.8 W/mK |
Recommended Bond Line Thickness | < 0.25 mm |
To determine the required material type and size, use the material code and container size as a suffix. For example, for a 10cc syringe of Silver epoxy adhesive, the part number will be “CA-SE-10”.
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Silver-filled electrically conductive epoxy adhesive is an effective and convenient alternative to traditional joining methods when it comes to bonding metal to metal. This adhesive is highly conductive and provides strong, durable connections you can rely on. With its smooth, thixotropic nature, it is perfect for assembling and prototyping metal enclosures, making the assembly process simple without costly machining, welding, or fasteners. This adhesive also acts as an excellent solution for cold-soldering repairs and can be used as a solder substitute for heat-sensitive electronic components and conductive joints. It also offers excellent EMI/RFI shielding and can effectively fill gaps between metal plates.
Product Code | CA-SE |
---|---|
Color | Silver |
Curing Time at 23°C | 24 hours |
Recommended Curing Time | 48 hours |
Density | 3.0 g/cm³ |
Lap Shear Strength (aluminum to aluminum) | 600 N/cm² |
Temperature Range | -50°C to 200°C |
Bond Resistance (aluminum to aluminum) | < 10mΩ/cm² |
Thermal Conductivity | 4.8 W/mK |
Recommended Bond Line Thickness | < 0.25 mm |
To determine the required material type and size, use the material code and container size as a suffix. For example, for a 10cc syringe of Silver epoxy adhesive, the part number will be “CA-SE-10”.
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