Kleje epoksydowe przewodzące CA-SE
Kleje epoksydowe przewodzące CA-SE

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Electrically Conductive Epoxy Adhesives CA-SE

Silver-filled electrically conductive epoxy adhesive is an effective and convenient alternative to traditional joining methods when it comes to bonding metal to metal. This adhesive is highly conductive and provides strong, durable connections you can rely on. With its smooth, thixotropic nature, it is perfect for assembling and prototyping metal enclosures, making the assembly process simple without costly machining, welding, or fasteners. This adhesive also acts as an excellent solution for cold-soldering repairs and can be used as a solder substitute for heat-sensitive electronic components and conductive joints. It also offers excellent EMI/RFI shielding and can effectively fill gaps between metal plates.

Technical Data

Product Code CA-SE
Color Silver
Curing Time at 23°C 24 hours
Recommended Curing Time 48 hours
Density 3.0 g/cm³
Lap Shear Strength (aluminum to aluminum) 600 N/cm²
Temperature Range -50°C to 200°C
Bond Resistance (aluminum to aluminum) < 10mΩ/cm²
Thermal Conductivity 4.8 W/mK
Recommended Bond Line Thickness < 0.25 mm

Features

  • Very high bond strength
  • Room temperature curing
  • Compatible with most common substrates – does not tarnish or discolor
  • Excellent aging resistance
  • Wide operating temperature range – maintains strength and conductivity under extreme conditions
  • Stable – low bond resistance during thermal cycling
  • Good gap-filling properties – suitable for fillet joint formation
  • Suitable as a solder replacement
  • Available in dual-barrel syringes of 4 cm³ and 10 cm³

Ordering Information

To determine the required material type and size, use the material code and container size as a suffix. For example, for a 10cc syringe of Silver epoxy adhesive, the part number will be “CA-SE-10”.

Epoxy adhesive

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Silver-filled electrically conductive epoxy adhesive is an effective and convenient alternative to traditional joining methods when it comes to bonding metal to metal. This adhesive is highly conductive and provides strong, durable connections you can rely on. With its smooth, thixotropic nature, it is perfect for assembling and prototyping metal enclosures, making the assembly process simple without costly machining, welding, or fasteners. This adhesive also acts as an excellent solution for cold-soldering repairs and can be used as a solder substitute for heat-sensitive electronic components and conductive joints. It also offers excellent EMI/RFI shielding and can effectively fill gaps between metal plates.

Technical Data

Product Code CA-SE
Color Silver
Curing Time at 23°C 24 hours
Recommended Curing Time 48 hours
Density 3.0 g/cm³
Lap Shear Strength (aluminum to aluminum) 600 N/cm²
Temperature Range -50°C to 200°C
Bond Resistance (aluminum to aluminum) < 10mΩ/cm²
Thermal Conductivity 4.8 W/mK
Recommended Bond Line Thickness < 0.25 mm

Features

  • Very high bond strength
  • Room temperature curing
  • Compatible with most common substrates – does not tarnish or discolor
  • Excellent aging resistance
  • Wide operating temperature range – maintains strength and conductivity under extreme conditions
  • Stable – low bond resistance during thermal cycling
  • Good gap-filling properties – suitable for fillet joint formation
  • Suitable as a solder replacement
  • Available in dual-barrel syringes of 4 cm³ and 10 cm³

Ordering Information

To determine the required material type and size, use the material code and container size as a suffix. For example, for a 10cc syringe of Silver epoxy adhesive, the part number will be “CA-SE-10”.

Epoxy adhesive
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