Двокомпонентна смола без ЈБР19.4 + Д19.4, полимеризација на собној температури
  • Двокомпонентна смола без ЈБР19.4 + Д19.4, полимеризација на собној температури

Фотографије су само у информативне сврхе. Погледајте спецификацију производа

please use latin characters

Произвођач: SEG

Двокомпонентна смола без ЈБР19.4 + Д19.4, полимеризација на собној температури

Application:
-Half hard resin is used in electro technical and electronic industry..
Main characteristic:
- epoxide two component resin with good thermal conductance, compatible with insulation systems class F.

Polymerisation:
- polymerisation is complete after 47h in temperature 20°C,
- it is recommended to heat up for an hour to temperature 50C after polymerization to obtain optimal parameters.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Storage conditions:
-6 months in original closed container, in temperature 10°C - 25 °C.

Packing:
- in containers 1, 5 i 20 kg and barrels 200 kg,
- part B is delivered in corresponding proportion to part A.

 
Preliminary polymer part A Hardener part B
viscosity @ 23°C   624 mPas viscosity @ 23°C   19 mPas
Reomat 108 E/R speed 50s+1 Reomat 108 E/R   190s+1
Volume weight   1,09 g/ml Volume weight   0,89 g/ml
Colour   transparent     yellow
Mixture A + B
Mixture weight ratio   100/20
Mixture volume ratio   80/20
Insert content   0%
viscosity @ 23°C   855 mPas
Reomat 108 E/R speed 50s+1
Volume weight   1,06 g/ml
lifetime  150 g @ 23°C   106 min
Gelation time @ 121°C   3min ± 30s
Exothermic peak @ 50 g   27 °C
Exothermic peak @ 100 g   28 °C
Exothermic peak @ 200 g   35 °C
Polymerisation
W20°C   18 h
W100°C   1 h30 min
Mechanical properties
Line shrinkage ISO 3521 %
Break off resistance ISO R 527 157 daN/cm2
Lengthening during break off ISO R 527 48,7 %
Shore hardness A/D @ 23°C ISO 868 D61
 
Electrical properties
Dielectric withstand CEI 243 20 kV/mm
 
Thermal properties
Constant operation temperature   od-30 do 155 °C
Self - extinguished UL 94 no
Мање
Опширније

Пошаљите упит

Да ли вас занима овај производ? Да ли су вам потребне додатне информације или појединачне цене?

Контактирајте нас

Питајте производ close
Порука је послата.
Питајте производ close
Прегледајте

Додај у листу жеља

морате бити пријављени

Application:
-Half hard resin is used in electro technical and electronic industry..
Main characteristic:
- epoxide two component resin with good thermal conductance, compatible with insulation systems class F.

Polymerisation:
- polymerisation is complete after 47h in temperature 20°C,
- it is recommended to heat up for an hour to temperature 50C after polymerization to obtain optimal parameters.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Storage conditions:
-6 months in original closed container, in temperature 10°C - 25 °C.

Packing:
- in containers 1, 5 i 20 kg and barrels 200 kg,
- part B is delivered in corresponding proportion to part A.

 
Preliminary polymer part A Hardener part B
viscosity @ 23°C   624 mPas viscosity @ 23°C   19 mPas
Reomat 108 E/R speed 50s+1 Reomat 108 E/R   190s+1
Volume weight   1,09 g/ml Volume weight   0,89 g/ml
Colour   transparent     yellow
Mixture A + B
Mixture weight ratio   100/20
Mixture volume ratio   80/20
Insert content   0%
viscosity @ 23°C   855 mPas
Reomat 108 E/R speed 50s+1
Volume weight   1,06 g/ml
lifetime  150 g @ 23°C   106 min
Gelation time @ 121°C   3min ± 30s
Exothermic peak @ 50 g   27 °C
Exothermic peak @ 100 g   28 °C
Exothermic peak @ 200 g   35 °C
Polymerisation
W20°C   18 h
W100°C   1 h30 min
Mechanical properties
Line shrinkage ISO 3521 %
Break off resistance ISO R 527 157 daN/cm2
Lengthening during break off ISO R 527 48,7 %
Shore hardness A/D @ 23°C ISO 868 D61
 
Electrical properties
Dielectric withstand CEI 243 20 kV/mm
 
Thermal properties
Constant operation temperature   od-30 do 155 °C
Self - extinguished UL 94 no
Мање
Опширније