FORM IN PLACE (FIP) Seals and Materials

Formed-in-place gaskets are also known as FIP or FIP-G, and they are a type of gasket that is automatically dispensed in the form of standard silicone or material that conducts electromagnetic interference (EMI). These types of gaskets are becoming increasingly popular in the electronics industry due to the dense design of modern electronic device enclosures. Our Form in Place gaskets are specifically designed to provide a seamless and effective solution for challenging sealing applications commonly encountered in complex electronics. Thanks to the automatic dispensing of silicone, FIP gaskets offer excellent sealing properties and reduce the likelihood of leaks, even in applications where traditional gaskets have failed in the past. The key feature that distinguishes EMI Form-in-Place gaskets is that they are developed for applications requiring inter-chamber isolation to separate signal processing and/or signal generating functions. FIP gaskets aim to reduce "noise" between compartments on a printed circuit board (PCB) or in an electronic housing. Additionally, FIP gaskets provide excellent electrical contact with adjacent conductive surfaces, including printed circuit board tracks, ensuring isolation between compartments. We offer a fast, free sample delivery service and can produce single parts up to large production batches. Typically, we require a DXF file of the part. This speeds up programming time and reduces lead time from receipt to completion of the product.

Features and Benefits

• Low tooling costs – simple enclosures and parts require minimal or no tooling.
• Small, precise gaskets – gaskets can be dispensed in smaller bead sizes than most traditional EMI shielding gaskets.
• Excellent adhesion – high adhesion to prepared surfaces such as machined metals, cast enclosures, and conductive plastics.
• High shielding effectiveness – FIP materials can provide shielding effectiveness >100 dB in the frequency range from 200 MHz to 12 GHz.
• Fast programming – quick and easy processing of samples and small batches.
• Complex geometries – FIP gaskets can adapt to very complex geometries, including sharp turns, corners, and repeating patterns.
• “T” connectors – FIP gaskets create reliable connections between tracks, providing continuous EMI/EMC shielding and environmental sealing.

FIP Design Information and Tips

• The gasket height in FIP ranges from 0.35 mm to 2 mm. The width is nominally 1.5 × height for a single bead.
• A general tolerance of ± 0.1 mm should be allowed.
• The adhesion of the formed-in-place gasket is typically >100 N/cm² (of the gasket imprint). This depends on the type and condition of the substrate. Oils and contaminants should be removed.
• The gasket path in the forming process can be defined manually or generated from a CAD/DXF file.
• The compression range for a formed-in-place gasket is usually 20% to 30% of the original height.
• Compression limiters or restrictions are recommended as they prevent over-compression and later damage to the gasket. They also allow fasteners to be tightened to their normal working torque.
• Our Form-in-Place gasket will provide resistance at low DC voltage > 200 mΩ/cm (measured across the gasket cross-section to the substrate it is applied to).
• Non-conductive sealing materials can operate at temperatures from –100 °C to +300 °C.
• Conductive sealing materials can operate at temperatures from –55 °C to +150 °C.

Available Conductive Form in Place Gaskets

In addition to custom dispensed gaskets, these materials are also available in containers with capacities of 10 cm³,

30 cm³, 55 cm³, 70 cm³, 170 cm³, and 310 cm³.

We also offer materials based on standard silicone and fluorosilicone.