Electrically Conductive Form-In-Place Material Gaskets

EMI-tec conductive compounds are particulary long time stable, highly conductive without preload with exceptionally low closing forces, a particulary wide temperature range and outstanding compressionset.

The EMI-tec Form-in-Place Gaskets offers an excellent hight-width ratio, which allows particularly small seal widths and hights (from 0,3 mm up to 1,8 mm, or greater) The Form-in-Place Gasket was developed and approved for high-tech air and space applications, automotive, telecommunication products (base stations, telephones, tetra communication devices and many more).

Micro-Sil Compound highly conductive

• Very low forces for closing the cabinets – super soft material
• Leading room temperature curing 1K materials
• Longtime stable no protection against galvanic corrosion necessary
• The compound can be applied directly on bare metal
• Longtimestable - no surface protection against galvanic corrosion nessecary
• Without any preforce
• Easily deformable compounds allow compensation of tolerances between parts with lesser height
• Extra wide temperature range
• Outstanding compression set
• Reusable seal with high reliability
• Re-sealing of the shelter possible
• Silicone-free available

CC-Micro-Sil Compound surface conductive

• Form in Place material with a soft non-conductive inner core - Covered with electrical high conductive material
• Especially suitable for large gasket dimensions
• Low costs and low compression forces