Category
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Adhesives
ECCOBOND TM D125 F – D125 FDR – D125 F3 – D125 F 5
SMD adhesives for very fast applications (50,000 points/h)
Low-temperature polymerization (2.5 mN at 120° C)
Ensures good component retention in the printed area
Syringe, needle application, die
Die coating
VP 80
Soldering emulsion coating
Protects PCB holes and contacts from solder
Short-term protection of PCBs from high temperatures up to 268°C C
Free from organic solvents
Quick drying (15 min)
Easy to remove by hand
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Adhesives
ECCOBOND TM D125 F – D125 FDR – D125 F3 – D125 F 5
SMD adhesives for very fast applications (50,000 points/h)
Low-temperature polymerization (2.5 mN at 120° C)
Ensures good component retention in the printed area
Syringe, needle application, die
Die coating
VP 80
Soldering emulsion coating
Protects PCB holes and contacts from solder
Short-term protection of PCBs from high temperatures up to 268°C C
Free from organic solvents
Quick drying (15 min)
Easy to remove by hand
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