Thermally Conductive Filling Materials Gap Pad 1500R
  • Thermally Conductive Filling Materials Gap Pad 1500R

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Manufacturer: BERGQUIST

Plastic Thermal Filler GAP Pad 1500r

Features
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction
• Electrically isolating

Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• RDRAM memory modules / chip scale packages
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader

Specifications
Thickness: 0.010-0.020" (0.254-0.508mm)
Hardness, Bulk Rubber (Shore 00): 40
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.5W/m-K

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Features
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction
• Electrically isolating

Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• RDRAM memory modules / chip scale packages
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader

Specifications
Thickness: 0.010-0.020" (0.254-0.508mm)
Hardness, Bulk Rubber (Shore 00): 40
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.5W/m-K