R&D

Navitas Semiconductor, a leader in GaN and SiC technology, has introduced new 1200V SiCPAK™ power modules with epoxy insulation, offering five times better thermal resistance than traditional solutions. Thanks to proprietary GeneSiC™ SiC MOSFET technology, the new modules ensure lower power loss, higher reliability, and resilience in extreme conditions. They are designed for applications such as EV chargers, industrial drives, UPS systems, and photovoltaic installations. As a pioneer in...

Ferrite cores play a crucial role in eliminating electromagnetic interference (EMI) and optimizing power supply systems. Learn how their magnetic properties influence filtration efficiency and the stability of electronic systems.

The article discusses the challenges and technologies used in power supply design on PCBs, which are essential for the development of modern electronic devices. Topics include component miniaturization, heat management, DC-DC converters, AC-DC converters, and voltage regulators. It also covers modern technologies such as graphene, Gallium Nitride (GaN), and cooling technologies that impact energy efficiency and space optimization. The article also addresses challenges related to prototyping...

Industrial fans play a key role in heat management in electronic systems, especially in R&D environments. The article discusses types of fans, such as axial, radial, and brushless, and their application in various cooling systems. It highlights the challenges related to component density, noise reduction, and energy consumption. Innovative solutions, including integration with IoT systems, enable dynamic cooling management, supporting R&D projects.

In today's world, where more and more electronic devices generate significant amounts of heat, efficient cooling becomes a key factor in ensuring the reliability and performance of these systems. In response to this challenge, the electronics industry is increasingly turning to innovative solutions such as liquid thermal conductive materials.

Thermal conductive materials are substances that efficiently transfer heat, used in various industries such as electronics, automotive, and energy. These include ceramic, metallic, and organic types, which play a crucial role in heat management, enhancing device performance, and advancing modern technologies.

In applications from 20 W to 20 MW, and with device voltages from 650 V to 6.5 kV, GeneSiC silicon carbide (SiC) MOSFETs and Schottky MPS™ diodes drive high-speed, high-efficiency power conversion across diverse markets including EV, industrial automation, solar, wind, grid, motor drives and defense. High-volume, high-quality shipments ensure application performance, reliability and uptime availability.

A novel GeneSiC Merged-PiN Schottky design combines the best features from both PiN and Schottky diode structures, producing the lowest forward voltage drop (VF), high surge-current capability (IFSM), and minimized temperature-independent switching losses.

Materiały termoprzewodzące są kluczowe w wielu branżach przemysłu, wpływając na efektywność systemów chłodzenia i ogrzewania. Wybór odpowiednich materiałów termoprzewodzących jest niezwykle istotny. Przed podjęciem decyzji warto zwrócić uwagę na następujące czynniki

Thermal management in electric vehicles is crucial for ensuring the efficiency and longevity of components such as batteries and electrical systems. Effective cooling, using specialized thermal materials like gap-filling liquids (GFL) and Softtherm pads, helps optimize performance and extend battery life, which is essential in the context of the development of electromobility and autonomous drive systems.

Keratherm © - KL 95 to samoprzylepna folia z wypełnieniem ceramicznym charakteryzująca się dobra przewodnością cieplną.

Technological development caused a need in electric engineering to search for new solutions in heat conduction.