Two component resin U4760 + D72- polymerization in an environmental temperature
  • Two component resin U4760 + D72- polymerization in an environmental temperature

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Manufacturer: SEG

U4760 + D72 two-component resin, polymerization at ambient temperature

Application:
Half hard resin is used to flooding in electronic and electro technical industry.

- transformers
- PCB
- electronic components flooding

General characteristic:
It is great resin with good electric and physics properties.
It is self - extinguished, has good thermal conductance and it's compatible with class B insulation system.

Storage conditions
It is recommended to: :
- Storage far away from light, cold or heat. In original, closed container. Product is very sensitive for humidity

Packing:
1-5 -12 and 20 kg containers or barrels 220 kg
part B is delivered in corresponding proportion to part A..
Life time: 12 months in temperature 10°C i 25°C A and for hardener 12 months in temperature 5°C i 30°C.
Usage: Open in ambient temperature 48h before usage.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Characteristic
Preliminary polymer part A Hardener part B
viscosity @ 23°C NSEG 0013 10 000 mPas viscosity @ 23°C NSEG 0013 70 mPas
(Reomat)   +/- 3 000   (Reomat)   +/- 50 mPas
Weight ISO 2811 1.72 g/ml Weight ISO 2811 1.17 g/ml
Colour   Black  
Colour
Brown

 

MIXTURE
Physical Mechanical

Mixture weight ratio		   100/ 16 +/- 1 Line shrinkage ISO 3521 < 0.5 %
Mixture volume ratio   81 / 19   Break off resistance ISO R 527 25 daN/cm2
Insert content   56 % Lengthening during break off ISO R 527 19 %
viscosity @ 23°C NSEG 0013 4 000 mPas Shore hardness A/D @ 23°C ISO 868 70 A
(Reomat)   +/- 1 200      
Volume weight ISO 2811 1.65 g/ml Dielectrical
lifetime  150 g @ 23°C NSEG 0005 11 min. Stiffness CEI 243 21 KV/mm
Gelation time @ 23°C - 150 g NSEG 0008 25 min. Constant @ 23°C CEI 250 3.12 (50 Hz)
Gelation time @ 78°C - 2.5 g NSEG 0012 3'40'' min. Tg d a 23°C CEI 250 17.7 10-3 (50 Hz)
    +/- 70''   Through resistance     Ohm.cm
Exothermic peak - 50 g NSEG 0007 29 °C Thermal properties
Exothermic peak - 100 g NSEG 0007 31 °C Constant operation temperature - 50 +125 °C
Exothermic peak - 200 g NSEG 0007 31 °C For constant usage  
  Thermal conductance 0.488 W/m.°C
Polymerisation or drying Glassy transformation   °C
@ 20°C NSEG 0010 4 H 30 mn Flammability SEG V0 5.5 mm
@ 60°C NSEG 0010 1 H 15 mn        
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Application:
Half hard resin is used to flooding in electronic and electro technical industry.

- transformers
- PCB
- electronic components flooding

General characteristic:
It is great resin with good electric and physics properties.
It is self - extinguished, has good thermal conductance and it's compatible with class B insulation system.

Storage conditions
It is recommended to: :
- Storage far away from light, cold or heat. In original, closed container. Product is very sensitive for humidity

Packing:
1-5 -12 and 20 kg containers or barrels 220 kg
part B is delivered in corresponding proportion to part A..
Life time: 12 months in temperature 10°C i 25°C A and for hardener 12 months in temperature 5°C i 30°C.
Usage: Open in ambient temperature 48h before usage.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Characteristic
Preliminary polymer part A Hardener part B
viscosity @ 23°C NSEG 0013 10 000 mPas viscosity @ 23°C NSEG 0013 70 mPas
(Reomat)   +/- 3 000   (Reomat)   +/- 50 mPas
Weight ISO 2811 1.72 g/ml Weight ISO 2811 1.17 g/ml
Colour   Black  
Colour
Brown

 

MIXTURE
Physical Mechanical

Mixture weight ratio		   100/ 16 +/- 1 Line shrinkage ISO 3521 < 0.5 %
Mixture volume ratio   81 / 19   Break off resistance ISO R 527 25 daN/cm2
Insert content   56 % Lengthening during break off ISO R 527 19 %
viscosity @ 23°C NSEG 0013 4 000 mPas Shore hardness A/D @ 23°C ISO 868 70 A
(Reomat)   +/- 1 200      
Volume weight ISO 2811 1.65 g/ml Dielectrical
lifetime  150 g @ 23°C NSEG 0005 11 min. Stiffness CEI 243 21 KV/mm
Gelation time @ 23°C - 150 g NSEG 0008 25 min. Constant @ 23°C CEI 250 3.12 (50 Hz)
Gelation time @ 78°C - 2.5 g NSEG 0012 3'40'' min. Tg d a 23°C CEI 250 17.7 10-3 (50 Hz)
    +/- 70''   Through resistance     Ohm.cm
Exothermic peak - 50 g NSEG 0007 29 °C Thermal properties
Exothermic peak - 100 g NSEG 0007 31 °C Constant operation temperature - 50 +125 °C
Exothermic peak - 200 g NSEG 0007 31 °C For constant usage  
  Thermal conductance 0.488 W/m.°C
Polymerisation or drying Glassy transformation   °C
@ 20°C NSEG 0010 4 H 30 mn Flammability SEG V0 5.5 mm
@ 60°C NSEG 0010 1 H 15 mn        
Less
Read more