Podkładka na płytkę PCB
Podkładka na płytkę PCB

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Manufacturer: Kitagawa GmbH

Podkładka na płytkę PCB

OGP pads ensure consistent contact between surfaces.

Description:

  • OGP solves solder flux-related contact issues;
  • Increased reliability compared to soldering;
  • Eliminates connection continuity issues caused by scratches between the PCB and the pogo pins or metal plate;
  • OGP-2520 is 40% smaller than the OGP-4520. (Product size: 2.5mm);


Material:

  • Base material: Brass;

   Surface treatment: Sn reflow plating;
※ First plating: Cu plating;
※ Surface treatment for OGP-3216: Au/Ni plating on both sides;


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OGP pads ensure consistent contact between surfaces.

Description:

  • OGP solves solder flux-related contact issues;
  • Increased reliability compared to soldering;
  • Eliminates connection continuity issues caused by scratches between the PCB and the pogo pins or metal plate;
  • OGP-2520 is 40% smaller than the OGP-4520. (Product size: 2.5mm);


Material:

  • Base material: Brass;

   Surface treatment: Sn reflow plating;
※ First plating: Cu plating;
※ Surface treatment for OGP-3216: Au/Ni plating on both sides;


Less

Read more

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