Components for power electronics, automations, electronics, electric

Główną zaletą analizy odporności urządzenia na poziomie układu scalonego jest fakt, że takie badanie nie  wymaga uwzględniania wpływu konstrukcji owego układu na kompatybilność elektromagnetyczną (EMC). Wspomniana analiza obejmuje przykładowo projekt  płytki drukowanej, charakter i dostępność złącza oraz  obudowę. W artykule opisano zależność między testami na poziomie urządzenia oraz układu scalonego (IC).

EMI (Electromagnetic Interference) refers to unwanted signals that can disrupt the operation of electronic devices. As electronics become smaller and more complex, they also become more susceptible to such interference. EMI can lead to errors, instability, or even system failures. That’s why proper circuit design — including electromagnetic shielding at the PCB level — is so important. This article explains how EMI shielding works, what materials to use, and how to avoid common design pitfalls.

Navitas Semiconductor, a leader in GaN and SiC technology, has introduced new 1200V SiCPAK™ power modules with epoxy insulation, offering five times better thermal resistance than traditional solutions. Thanks to proprietary GeneSiC™ SiC MOSFET technology, the new modules ensure lower power loss, higher reliability, and resilience in extreme conditions. They are designed for applications such as EV chargers, industrial drives, UPS systems, and photovoltaic installations. As a pioneer in next-generation semiconductors, Navitas also offers the world’s first 20-year warranty on GaNFast™ devices.