Two-component resin with E819CA + D91 load, polymerization at room temperature
Two-component resin with E819CA + D91 load, polymerization at room temperature

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Manufacturer: SEG

Two-component resin with E819CA + D91 load, polymerization at room temperature

Application:
 Half hard resin is used in electro technical and electronic industry.
- Electric material insulation,
- for electronic components flooding.

Main characteristic:
-  two component resin with good thermal conductance and compatible with insulation systems class F.

Storage conditions:
It is recommended to:
- Storage far away from light, heat, cold source, in original closed container.
- product highly sensitive for humidity,
- storage time: 4 months in temperature  10°C - 25°C,
- hardener: 12 months in temperature 5°C - 30°C,
- usage: bring to ambient temperature 48 hours before usage.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Packing:
- in containers 1, 5 and 20 kg and barrels 220 kg,
- part B is delivered in corresponding proportion to part A..

Preliminary polymer part A Hardener part B
viscosity @ 23°C /Reomat NSEG0013 12 600±4 000mPas viscosity @  23°C /Reomat NSEG0013 680 ± 200 mPas
Volume weight ISO 2811   Volume weight ISO 2811 1,00 g/ml
Colour   brown Colour   yellow
Mixture A + B
Mixture weight ratio   100 /13 ± 1
Mixture volume ratio   100/17,7
Insert content   53%
viscosity @ 23°C /Reomat/ NSEG0013 1 800 ± 700 mPas
Volume weight ISO 2811 1,28 g/ml
lifetime 150g @ 23°C NSEG 0005 29 min
Gelation time @ 23° -150 g NSEG 0008 59 min
Gelation time @ 78°- 2,5 g NSEG 0012 7 min 30 s ± 3 min
Exothermic peak @50 g NSEG 0007 30 °C
Exothermic peak @ 100g NSEG 0007 30 °C
Exothermic peak @ 200g NSEG 0007 36 °C
 
Polymerisation
W20°C NSEG 0010  
W60°C NSEG 0010 45 min
 
Mechanical properties
Line shrinkage ISO 3521 < 1.0%
Stretch ISO R 527 210daN/cm2
Lengthen ISO R 527 <4%
Shore hardness A/D @ 23°C ISO 868 60 D
 
Electrical properties
Dielectric withstand CEI 243 20 kV/mm
Dielectric constant @ CEI 250 (50 Hz)
Tg d @ 23°C CEI 250 (50 Hz)
 
Thermal properties
Constant operation temperature   -40+155°C
Thermal conductance   0.60 ±0.1 W/m.°C
Glassy phase   41 °C
Self - extinguished SEG V0 6 mm
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Application:
 Half hard resin is used in electro technical and electronic industry.
- Electric material insulation,
- for electronic components flooding.

Main characteristic:
-  two component resin with good thermal conductance and compatible with insulation systems class F.

Storage conditions:
It is recommended to:
- Storage far away from light, heat, cold source, in original closed container.
- product highly sensitive for humidity,
- storage time: 4 months in temperature  10°C - 25°C,
- hardener: 12 months in temperature 5°C - 30°C,
- usage: bring to ambient temperature 48 hours before usage.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Packing:
- in containers 1, 5 and 20 kg and barrels 220 kg,
- part B is delivered in corresponding proportion to part A..

Preliminary polymer part A Hardener part B
viscosity @ 23°C /Reomat NSEG0013 12 600±4 000mPas viscosity @  23°C /Reomat NSEG0013 680 ± 200 mPas
Volume weight ISO 2811   Volume weight ISO 2811 1,00 g/ml
Colour   brown Colour   yellow
Mixture A + B
Mixture weight ratio   100 /13 ± 1
Mixture volume ratio   100/17,7
Insert content   53%
viscosity @ 23°C /Reomat/ NSEG0013 1 800 ± 700 mPas
Volume weight ISO 2811 1,28 g/ml
lifetime 150g @ 23°C NSEG 0005 29 min
Gelation time @ 23° -150 g NSEG 0008 59 min
Gelation time @ 78°- 2,5 g NSEG 0012 7 min 30 s ± 3 min
Exothermic peak @50 g NSEG 0007 30 °C
Exothermic peak @ 100g NSEG 0007 30 °C
Exothermic peak @ 200g NSEG 0007 36 °C
 
Polymerisation
W20°C NSEG 0010  
W60°C NSEG 0010 45 min
 
Mechanical properties
Line shrinkage ISO 3521 < 1.0%
Stretch ISO R 527 210daN/cm2
Lengthen ISO R 527 <4%
Shore hardness A/D @ 23°C ISO 868 60 D
 
Electrical properties
Dielectric withstand CEI 243 20 kV/mm
Dielectric constant @ CEI 250 (50 Hz)
Tg d @ 23°C CEI 250 (50 Hz)
 
Thermal properties
Constant operation temperature   -40+155°C
Thermal conductance   0.60 ±0.1 W/m.°C
Glassy phase   41 °C
Self - extinguished SEG V0 6 mm
Less
Read more
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