Mocowanie boczne/OGSC- (T)(B)-302020
Mocowanie boczne/OGSC- (T)(B)-302020

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Manufacturer: Kitagawa GmbH

Mocowanie boczne/OGSC- (T)(B)-302020

Side mounting perpendicular to ground.

Description:

  • Ideal for applications where traditional parallel mounting between the board and housing is impossible;
  • Thanks to its low profile (2mm), it is perfect for small electronics;
  • Operating temperature: -40 – 125°C;



Material:

  • Corson alloy (t=0.08mm);



Product

OGSC-T-302020

OGSC-B-302020

Application

Grounding during SMD installation

Material

Stop Corson (t=0.08mm)

Surface treatment

Sn reflow plating (copper substrate)

Recommended operating temperature (°C)

-40 – 125°C

Compression range

0.3-1.0

Resistance (Ω)

≤0.05

Initial compression force (N)

0.2 – 3.1

0.4 – 3.0


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Side mounting perpendicular to ground.

Description:

  • Ideal for applications where traditional parallel mounting between the board and housing is impossible;
  • Thanks to its low profile (2mm), it is perfect for small electronics;
  • Operating temperature: -40 – 125°C;



Material:

  • Corson alloy (t=0.08mm);



Product

OGSC-T-302020

OGSC-B-302020

Application

Grounding during SMD installation

Material

Stop Corson (t=0.08mm)

Surface treatment

Sn reflow plating (copper substrate)

Recommended operating temperature (°C)

-40 – 125°C

Compression range

0.3-1.0

Resistance (Ω)

≤0.05

Initial compression force (N)

0.2 – 3.1

0.4 – 3.0


Less

Read more
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